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Printed circuit



Introduction

This book is a training material designated by the Printed Circuit Technology Department of the Production Technology Credit Branch of the Chinese Institute of Electronics. The book consists of 15 chapters, divided into three parts: the first part (chapters 1 to 9) mainly introduces the printed circuit board materials and various processing techniques; the second part (chapters 10 to 13) focuses on the rigid multilayer printing Board production technology, high-density interconnection build-up multilayer board technology, flexible and rigid-flex printed board production technology, metal-based (core) printed board and other printed board production technologies; Part Three (14, Chapter 15) introduces printed circuit technical specifications, inspection and water treatment technology and environmental protection.

This book can be used not only as a training material for highly skilled personnel in the printed circuit, but also as a reference book for practitioners in the printed circuit industry and related professional teachers and students.

Book catalog

1 Overview

1.1 Definition and function of printed boards

1.2 Classification of printed boards

1.3 Brief history of the development of printed boards

1.4 Main manufacturing methods of printed boards

1.5 New developments in the production technology of high-density and high-precision printed boards

1.6 Future development trends of printed boards

2 Printed circuit board substrate materials

2.1 Classification and varieties of substrate materials

2.2 PCB substrate materials Performance requirements

2.3 Production and manufacturing of substrate materials

2.4 Semi-cured sheets for general copper clad laminates and multilayer boards

2.5 High-performance substrate materials

< p>2.6 Flexible substrate materials for flexible printed circuit boards

3 CAD/CAM and optical drawing plate technology of printed circuit boards

3.1 Design of printed circuit boards< /p>

3.2 Computer Aided Manufacturing (CAM)

3.3 Optical drawing plate process

4 Printed circuit board machining

4.1 Copper clad laminate Blanking

4.2 Hole processing

4.3 CNC milling

4.4 Printed circuit board punching

4.5 Printed circuit board plug ( Golden finger) chamfering

4.6 V-cut cutting (V-cut)

5 Electroless copper plating and direct electroplating

5.1 Electroless copper plating

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5.2 Direct electroplating

6 Photochemical image transfer process

6.1 Dry film photoresist image transfer process (referred to as dry film)

6.2 Liquid photoresist image transfer process (wet film for short)

6.3 Electrodeposition photoresist image transfer process (for ED film for short)

6.4 Laser direct imaging technology (LDI technology)

7 Acidic copper plating and surface plating (coating) process

7.1 Acidic copper plating

7.2 Electroplating tin-lead alloy

7.3 Electroplating tin and tin-based alloy

7.4 Removal of tin-lead (or tin) plating

7.5 hot air leveling

7.6 tin-lead alloy Hot melt of plating

7.7 Nickel plating

7.8 Gold plating

7.9 Organic soldering protection film

7.1 0 Chemical nickel plating, Electroless gold plating

8 Etching process

8.1 The meaning and function of printed circuit board etching

8.2 Etching solution

8.3 Etching process flow , Etching equipment and etching solution recycling

8.4 Etching quality Quantity requirement and detection and control

8.5 New development of etching solution and etching process

9 Printed board ink coating process

9.1 Ink coating process The meaning and function of

9.2 Screen printing process

9.3 Screen printing graphics process

9.4 Wet film coating process

9.5 Curtain coating Solder mask process

9.6 Carbon film printed board manufacturing process

9.7 Conductive paste through-hole printed board manufacturing technology

10 Rigid multilayer printed board production Process

10.1 Basic concepts of multilayer printed boards

10.2 Base material for multilayer printed boards

10.3 Process flow of multilayer printed boards

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10.4 Multi-layer printed board positioning system

10.5 Multi-layer printed board inner layer surface treatment

10.6 Multi-layer printed board lamination

10.7 Drilling and resin removal

10.8 Two major issues that must be paid attention to in the production of multilayer printed boards

11 High-density interconnect multilayer multilayer boards Process

11.1 Advantages of multilayer multilayer boards

11.2 Basic characteristics of multilayer multilayer boards

11.3 Types of multilayer multilayer boards

11.4 Insulating materials for multilayer multilayer boards

11.5 Manufacturing process of multilayer multilayer boards

11.6 Quality inspection of multilayer multilayer boards

< p>12 Flexible and rigid-flex printed board production technology

12.1 Features, applications and classifications of flexible and rigid-flex printed boards

12.2 Flexible and rigid-flex printing Board material

12.3 Design of flexible printed board

12.4 Manufacturing process of flexible and rigid-flex printed board

12.5 Flexibility and rigid-flex Performance requirements of printed boards

12.6 Development trend and forecast of flexible and rigid-flex printed boards

13 Metal-based (core) printed boards

13.1 The meaning, characteristics and applications of metal-based (core) printed boards

13.2 Metal-based printed boards

13.3 Metal-core printed boards

13.4 Metal Development trend and application prospects of base (core) printed boards

14 Printed circuit technical specifications and inspection

14.1 Quality inspection

14.2 Printed circuit standardization

14.3 Technical specifications

14.4 Finished product inspection

14.5 Quality assurance provisions and delivery inspection requirements

14.6 Packaging , Transportation, storage (packaging,shipmen t,storage)

15 Printed circuit board water treatment technology and its environmental protection

15.1 Basic concepts of printed circuit board water treatment technology

15.2 Print Water treatment technology for printed circuit boards

15.3 Printed circuit board production water

15.4 "Three wastes" treatment technology in the production of printed circuit boards

15.5 Print Recycling technology of printed circuit board waste

15.6 Printed circuit board water treatment equipment and equipment and chemical reagents

15.7 Environmental protection and environmental management in the production of printed circuit boards

15.8 Introduction to ISO 14000 Standard

Appendix

Appendix 1 Hardness Unit

Appendix 2 ASTM Electronic Grade Water Standard

Appendix 3 Water quality requirements for the electronics industry

Appendix 4 International discharge standards for printed board wastewater (copper-containing wastewater)

Appendix 5 Printed circuit board industry pollution prevention plan

< p>References
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