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Electrolytic plating power supply



◆Electrolyticplatingpowersupplydescription:

1.Smallsize,lightweight,highefficiency

Usingauniqueassemblystructuremethod,thereasonableapplicationofnanotechnologymakesTheproductisminiaturizedandlightweight,whichnotonlysavesspacebutalsoimprovesefficiency.

2.High-frequencypulsecurrentoutput

Suitablefornon-ferrousmetalsandalloyplatingprocessrequirements,strongpenetration,goodadhesion,caneffectivelyimprovethedepositionspeedofthecoating.

3.Flexibleuse,simpleoperation

Theoutputvoltageandcurrentcanbeadjustedarbitrarily.Stableandstablecurrent,flexibleconversion.Itcanbeflexiblysetaccordingtotherequirementsoftheelectroplatingprocess.

4.Completeprotectionfunctions

Withinputundervoltage,overvoltage,phaselossprotection,outputovercurrent,overheatingandmanyotherprotectionfunctions,theproductisstableandreliable,andtheinternalstructureadoptsairductsProcessing,allelectronicvitalitypartsaresealed.Reducetheinfluenceoftheexternalenvironmentonthevitalitypartsoftheequipment.

5.Strongexpandablefunction

Timecontrolfunctioncommunicationfunction(4-20mA,0-5V,0-10Vstandardcontrolsignalinterfacecanbeadded).

Softstartfunction,currenttotalizingfunction(Amperehour).

6.Completemodels

Theoutputspecifications(outputvoltage.outputcurrent)areoptional.

Optionalfunctioncontrolmodeisoptional.

◆Electrolyticplatingpowersupplyuse:

Suitableforplatingacidcopper,alkalinecopper,nickel,zinc,lead.Electroplatingoccasionssuchaselectrolyticoilremoval.

◆Electrolyticplatingpowersupplyparameters:

Electrolyticplatingpowersupply

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